Recent Progress in Lead-Free Solder Technology

Recent Studies in The Development of Ceramic Reinforced Lead-Free Composite Solder.- Development of Geopolymer Ceramic Reinforced Solder.- Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders.- Molecular Dynamic on the Nanoparticle Reinforcement into Lead-free Solder during Reflow Soldering Process.- Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics.- Advanced assembly of Miniaturized Surface Mount Technology Components using Nano-Reinforced Solder Paste.- Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi.- The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation & Experimental.- Flux Modification for Wettability and Reliability Improvement in Solder Joints.- Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints.- Significance of Interfacial Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint and Methods of IMC Layer Thickness Measurements.- The Effect of Laser Soldering onto Intermetallic Compound Formation and Growth.- Reliability Analysis on the Flexible Printed Circuit Board During Reflow Soldering.- Solder Paste's Rheology Data for Stencil Printing Numerical Investigations.- Tin Whiskers Growth in Electronic Assemblies

Mohd Arif Anuar Mohd Salleh (Ph.D.) is an associate professor of materials engineering at the Faculty of Chemical Engineering Technology, Universiti Malaysia Perlis. He graduated with a B.Eng (Hons) in Mechanical Engineering, followed by M.Eng in Mechanical Engineering majoring in Materials at the Universiti Tun Hussein Onn Malaysia. He received his Ph.D. from the University of Queensland, Australia, in Materials Engineering, specializing in the development of advanced solder materials. He is also a certified Professional Engineer and a corporate member of the Institute of Engineers, Malaysia (IEM). He is currently the Chairman of Tin Solder Technology Research Malaysia under the Tin Industry Board (Research and Development), Malaysia. He worked in and lectured on the subject of electronic packaging materials for more than 14 years. Before joining Universiti Malaysia Perlis, he was employed as a Failure Analysis Engineer at Intel Malaysia. He also worked part-time researchofficer for a few research projects on solder materials development at the University of Queensland Australia (2013-2015) and Imperial College London (2015). He has published more than 190 articles, encompassing proceedings, journals, books, and modules as primary author and co-author, and has an H-index of 16. His research endeavors were significant and impactful, as reflected in his receiving grants worth RM5.5 million.
Mohd Sharizal Abdul Aziz (Ph.D) received the B.Eng, M.Sc., and Ph.D. degrees from the Universiti Sains Malaysia, in 2006, 2012, and 2015. In June 2016, he became a Senior Lecturer at the School of Mechanical Engineering, Engineering Campus, Universiti Sains Malaysia, Penang, Malaysia. Sharizal is the author or co-author of more than 100 papers in the international journal, book chapter, and conference proceeding with the current H-index 9. He has given numerous invited/ keynote talks at international conferences. Sharizal also organizedworkshops on Soldering &