Mechanics and Properties of Composed Materials and Structures

.-Numerical Model for Static and Dynamic Analysis of Masonry Structures..-Wrinkling Analysis of Rectangular Soft-Core Composite Sandwich Plates..-Artificial Neural Network Modelling of Glass Laminate Sample Shape Influence on the ESPI Modes..-Nonlinear Dynamic Analysis of Structural Steel Retrofitted Reinforced Concrete Test Frames..-Acoustical Properties of Cellular Materials..-Simulation of the Temperature Change Induced by a Laser Pulse on a CFRP Composite using a Finite Element Code for Ultrasonic Non-Destructive Testing..-Macroscopic Behavior and Damage of a Particulate Composite with a Crosslinked Polymer Matrix..-Computational Simulations on Through-drying of Yarn Packages with Superheated Steam..-Anisotropic Stiffened Panel Buckling and Bending Analyses using Rayleigh-Ritz Method..-Investigation of Cu-Cu Ultrasonic Bonding in Multi-Chip Package using Non-Conductive Adhesive..-Natural Vibration Analysis of Soft Core Corrugated Sandwich Plates using Three-Dimensional Finite Element Method..-A New High Strength 0-3 PZT Composite for Structural Health Monitoring..-Free Vibration Analysis of Sandwich Plates with Temperature-Dependent Properties of the Core Materials and Functionally Graded Face Sheets.

Lucas F. M. da Silva is currently Assistant Professor at the Faculty of Engineering of the University of Porto. He received a PhD related to adhesive bonding in 2004 from the University of Bristol under the supervision of Prof RD Adams. Since then, he has been teaching and investigating structural adhesive joints. The work covers a wide range of engineering structural adhesives such as epoxies, acrylics and bismaleimides. Several test methods for adhesive joints are available at the FEUP including various joint configurations such as bulk specimens, lap shear joints and butt joints. In addition to the experimental expertise, detailed analytical models and finite element analysis of stresses and strains within the joints are also undertaken.
In 2005 he joined the editorial board of the "International Journal of Adhesion and Adhesives".