Mechanical Properties of Cementitious Materials at Microscale

Introduction.- Preparation of Samples for Microscopic Testing.- Experimental Techniques.- Phase Identification and Size Quantification.- Microstructure Characterization.- Modulus and Stiffnes at Microscale.- Fracture Properties at Microscale.- Creep Properties at Microscale.- Modulus Calculation across Scales.- Creep Calculation across scales.- Prediction of Permeability based on Microsctructure.- Summary.

Ya Wei obtained her doctorate from University of Michigan at Ann Arbor in 2008. She joined in Tsinghua University in 2010 and currently is an associate professor of civil engineering. Her research interests include developing ultra-high performance cement-based materials and intelligent materials for transportation infrastructure; multi-scale characterizing and simulating mechanical properties of cement-based materials; optimized design and serviceability enhancement of concrete pavements; pavement health monitoring and low-cost, rapid repair technology; mechanical analysis and structural optimization of long-span steel bridge pavement system. Siming Liang obtained his doctorate from Tsinghua University in 2018. He has joined Sun Yat-sen University since 2020 as an assistant professor in civil engineering. His current interests include multiscale measurement and simulation of mechanical properties and time-dependent deformations of cementitious materials; smart cementitious materials for transportation infrastructure; structural optimization of high-speed railway ballastless track slab. Weikang Kong obtained his master's degree from Chang'an University, China, in 2020. He entered Tsinghua University in 2020 to work on his doctorate in the field of civil engineering. His current interests include multifunctional application of nanoscratch technique to characterize cementitious materials; multi-scale characterization of the fracture properties of cementitious materials; mechanical analysis and structural optimization of long-span road-rail steel bridges.