Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
(Sprache: Englisch)
Electromechanical processes for Ultra-large-Scale Integration technology for Integrated Circuits applications is a new frontier in electrochemistry and science. This book details copper based interconnect technology for ULSI technology to ICs application.
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Electromechanical processes for Ultra-large-Scale Integration technology for Integrated Circuits applications is a new frontier in electrochemistry and science. This book details copper based interconnect technology for ULSI technology to ICs application.
Klappentext zu „Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications “
In Advanced ULSI interconnects - fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous "Moore's law" which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
This book presents one of the new frontiers of modern electrochemistry science and technology: electrochemical processes for Ultra-large-Scale Integration (ULSI) technology for Integrated Circuits (ICs) applications. This is a field which influences our day to day life and still presents major technological and scientific challenges. This book reviews ULSI technology in light of all the novel electrochemical processes which make ULSI technology possible. The book will focus on sub-100 nm CMOS technology, mainly on copper-based metallization.
Inhaltsverzeichnis zu „Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications “
- Introduction- Technology Background
- Interconnect Materials
- Deposition Processes for ULSI Interconnects
- Modeling
- Electrochemical Process Integration
- Electrochemical Processes and Tools
- Metrology
- Summary and Foresight
Bibliographische Angaben
- 2009, XX, 552 Seiten, Maße: 16 x 24,1 cm, Gebunden, Englisch
- Herausgegeben: Yosi Shacham-Diamand, Tetsuya Osaka, Madhav Datta, Takayuki Ohba
- Verlag: Springer, Berlin
- ISBN-10: 0387958673
- ISBN-13: 9780387958675
- Erscheinungsdatum: 27.10.2009
Sprache:
Englisch
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